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Hybrid thermoelectric conversion for enhanced efficiency in mobile platforms

TitleHybrid thermoelectric conversion for enhanced efficiency in mobile platforms
Publication TypeJournal Article
Year of Publication2007
AuthorsMuhtaroglu, A., A. von Jouanne, and A. Yokochi
JournalJournal of Micromechanics and Microengineering
Pagination1767 - 1772
Date Published09/2007

Hybrid thermoelectric conversion (HTC) has been used as a means to improve the efficiency of high performance mobile computing systems. HTC utilizes the thermal margin in the cooling solution, when the electronic component is not fully active, to integrate a thermoelectric (TE) module into the heat dissipation path for energy scavenging. When the component is driven to its junction temperature limit through a heavy workload, the same TE module is switched to refrigeration mode to provide additional cooling headroom for improved performance. A set of semi-realistic system usage assumptions and parameters has been utilized for the evaluation of HTC in system environments. Results from finite-element analysis (FEA) simulation of the topology and full TE characterization are presented. Common TE models are then used to build an iterative system solver to estimate up to 10% system efficiency benefit from HTC integration using characterized off-the-shelf TE components.

Short TitleJ. Micromech. Microeng.