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CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate

TitleCAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate
Publication TypeJournal Article
Year of Publication2000
AuthorsZheng, J., Y-C. Hahm, V. K. Tripathi, and A. Weisshaar
JournalIEEE Transactions on Microwave Theory and Techniques
Volume48
Issue9
Pagination1443 - 1451
Date Published09/2000
ISSN00189480
Abstract

A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si-SiO₂ substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. Equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent-circuit models is shown to be in good agreement with the frequency-dependent transmission line characteristics of single and general coupled on-chip interconnects.

DOI10.1109/22.868993
Short TitleIEEE Trans. Microwave Theory Techn.