OREGON STATE UNIVERSITY

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Impact of Metal Fill on On-chip Interconnect Performance

TitleImpact of Metal Fill on On-chip Interconnect Performance
Publication TypeConference Paper
Year of Publication2009
AuthorsShilimkar, V. S., S. G. Gaskill, and A. Weisshaar
Conference NameProc. IEEE 18th Topical Meeting on Electrical Performance of Electronic Packaging and Systems (EPEPS'2009)
Pagination101-104
Date Published10/2009