OREGON STATE UNIVERSITY

You are here

Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

TitleCharacterization and modeling of multiple coupled on-chip interconnects on silicon substrate
Publication TypeConference Paper
Year of Publication2000
AuthorsZheng, J., V. K. Tripathi, and A. Weisshaar
Conference NameIEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging
Pagination333 - 336
Date Published10/2000
PublisherIEEE
Conference LocationScottsdale, AZ
Abstract

A quasi-static EM solver based on partial element equivalent circuits is applied to characterize multiple coupled microstrip on-chip interconnects on silicon. The EM solver takes into account the substrate skin effect as well as the conductor skin and proximity effects. Equivalent circuits consisting of only ideal passive elements are extracted from the EM data. Extraction results are presented for a coupled three-line interconnect structure.

DOI10.1109/EPEP.2000.895557