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LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

TitleLTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications
Publication TypeJournal Article
Year of Publication2011
AuthorsKam, D G., D. Liu, A. Natarajan, S. Reynolds, H-C. Chen, and B. A. Floyd
JournalIEEE Microwave and Wireless Components Letters
Volume21
Issue3
Pagination142 - 144
Date Published03/2011
ISSN1558-1764
Keywords60 GHz, antenna-in-package, millimeter-wave package, phased-array antennas
Abstract

A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. 60 GHz interconnects, including flip-chip transitions and via structures, are optimized using full-wave simulation. Anechoic chamber measurement has shown ~ 5 dBi unit antenna gain across all four IEEE 802.15.3c channels, achieving excellent model-to-hardware correlation. The packaged transmitter and receiver ICs, mounted on evaluation boards, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s.

DOI10.1109/LMWC.2010.2103932
Short TitleIEEE Microw. Wireless Compon. Lett.