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Low-cost antenna-in-package solutions for 60-GHz phased-array systems

TitleLow-cost antenna-in-package solutions for 60-GHz phased-array systems
Publication TypeConference Paper
Year of Publication2010
AuthorsKam, D G., D. Liu, A. Natarajan, S. Reynolds, and B. A. Floyd
Conference NameIEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Pagination93 - 96
Date Published10/2010
Conference LocationAustin, TX
ISBN Number978-1-4244-6865-2
Keywords60 GHz, antenna-in-package, millimeter-wave package, phased-array antennas

A low-cost, fully-integrated antenna-in-package solution for 60-GHz phased-array system is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached phased-array transmitter or receiver chip. The packages have first been fabricated using low temperature co-fired ceramic technology, and then built using conventional printed circuit board processes for lower manufacturing cost. Antenna chamber measurement has shown ~5 dBi unit antenna gain across the 60-GHz frequency band covering all four IEEE 802.15.3c channels. The packaged transmitter and receiver chipsets, each mounted on an evaluation board, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s.