A low-cost, fully-integrated antenna-in-package solution for 60-GHz phased-array system is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached phased-array transmitter or receiver chip. The packages have first been fabricated using low temperature co-fired ceramic technology, and then built using conventional printed circuit board processes for lower manufacturing cost. Antenna chamber measurement has shown ~5 dBi unit antenna gain across the 60-GHz frequency band covering all four IEEE 802.15.3c channels. The packaged transmitter and receiver chipsets, each mounted on an evaluation board, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s.