OREGON STATE UNIVERSITY

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Densification and improved electrical properties of pulse-deposited films via in situ modulated temperature annealing

TitleDensification and improved electrical properties of pulse-deposited films via in situ modulated temperature annealing
Publication TypeJournal Article
Year of Publication2004
AuthorsConley, J. F., Y. Ono, and D. J. Tweet
JournalApplied Physics Letters
Volume84
Issue11
Pagination1913-1915
Date Published03/2004
ISSN00036951
Abstract

We find that the modulated temperature annealing of pulse-deposited high dielectric constant films, in which brief in situ elevated temperature anneals are performed after every deposition cycle, results in film densification, a reduction in interfacial layer thickness, and a strong improvement in electrical properties. The densification and improvement of electrical properties could not be achieved solely by postdeposition annealing at temperatures up to 850 °C.

DOI10.1063/1.1667619
Short TitleAppl. Phys. Lett.