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Research Collaboration: Research Faculty

Andreas Weisshaar
Recent Publications


Books and Book Chapters

  • A. Weisshaar, "Transmission Lines," pp. 185-226, Chapter 6 in Handbook of Engineering Electromagnetics, edited by R. Bansal, Marcel Dekker, NY, 2004.
  • P. C. Magnusson, G. C. Alexander, V. K. Tripathi, A. Weisshaar, Transmission Lines and Wave Propagation, 4th Edition, CRC Press, 2001.

Journal Publications

  • A. Watson, D. Melendy, P. Francis, K. Hwang, and A. Weisshaar, "A Comprehensive Compact Modeling Methodology for Spiral Inductors in Silicon-Based RFICs," IEEE Trans. Microwave Theory Tech., vol. 52, no. 3, pp. 849-857, March 2004.
  • A. Weisshaar and A. Luoh, "Closed-form Expressions for the Series Impedance Parameters of On-Chip Interconnects on Multilayer Silicon Substrates," IEEE Trans. Adv. Packaging, vol. 27, no. 1, pp. 127-134, Feb. 2004.
  • C. Lim, R. K. Settaluri, V. K. Tripathi, and A. Weisshaar, "Compact Single- and Multi-Level Folded-Line RF Power Dividers," Microwave and Optical Technology Letters, vol. 39, Issue 3, pp. 187-189, Nov. 2003.
  • Weisshaar, H. Lan, and A. Luoh, "Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate," IEEE Trans. Adv. Packaging, vol. 25, no. 2, pp. 288-296, May 2002.
  • D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, "A New Wide-Band Compact Model for Spiral Inductors in RFICs," IEEE Electron Device Lett., vol. 23, No. 5, pp. 273-275, May 2002.
  • R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, "Design of Compact Multilevel Folded-Line Bandpass Filters," IEEE Trans. Microwave Theory Tech., vol. 49, no. 10, pp. 1804-1809, Oct. 2001.
  • J. Zheng, V. K. Tripathi, and A. Weisshaar, "Characterization and Modeling of Multiple Coupled On-Chip Interconnects on Silicon Substrate," IEEE Trans. Microwave Theory Tech., vol. 49, no. 10, pp. 1733-1739, Oct. 2001.
  • R. D. Lutz, V. K. Tripathi, and A. Weisshaar, "Enhanced Transmission Characteristics of On-Chip Interconnects with Orthogonal Gridded Shield," IEEE Trans. Adv. Packaging, vol. 24, no. 3, pp. 288-293, Aug. 2001.
  • R. D. Lutz, V. K. Tripathi, and A. Weisshaar, "Design Considerations for Multilevel Spiral Inductors in RFICs" (selected/invited), The International Journal of Microcircuits and Electronic Packaging, vol. 24, no. 1, pp. 37-44, 2001.
  • K. A. Remley, H. R. Anderson, and A. Weisshaar, "Improving the Accuracy of Ray-Tracing Techniques for Indoor Propagation Modeling," IEEE Trans. Vehic. Technol., vol. 49, no. 6, pp. 2350-2356, Nov. 2000.
  • •J. Zheng, Y.-C. Hahm, V.K. Tripathi, and A. Weisshaar, "CAD-Oriented Equivalent Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate," IEEE Trans. Microwave Theory Tech., vol. 48, no. 9, pp. 1443-1451, Sept. 2000.
  • R. K. Settaluri, G. Sundberg, A. Weisshaar, and V. K. Tripathi, "Compact Folded Line Rat Race Hybrid Couplers," IEEE Microwave Guided Wave Lett., vol. 10, no. 2, pp. 61-63, Feb. 2000.

Conference Publications

  • J. Kolstad, C. Blevins, J. Dunn, and A. Weisshaar, "A New Modeling Methodology for Passive Components Based on Black-Box Augmentation Combined with Equivalent Circuit Perturbation," Proc. IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2004), Oct. 2004.
  • A. Watson, Y. Mayevskiy, P. Francis, K. Hwang, G. Srinivasan, and A. Weisshaar, "Compact Modeling of Differential Spiral Inductors in Si-Based RFICs," IEEE MTT-S International Microwave Symposium, June 2004.
  • D. W. Ferwalt and A. Weisshaar, "A Base Control Doherty Power Amplifier for Improved Efficiency in GSM Handsets," IEEE MTT-S International Microwave Symposium, June 2004.
  • R. Senguttuvan, L. Hayden, and A. Weisshaar, "Mode Coupling in Coplanar Waveguide Bends: A simple Four-Port Model," Proceedings of the 33rd European Microwave Conference, pp. 643-646, Oct. 2003.
  • R. K. Settaluri and A. Weisshaar, "A Broadside-Edge-Coupled Vialess Balun," IEEE MTT-S International Microwave Symposium Digest, pp. 1251-1254, June 2003.
  • A. Watson, P. Francis, C. Pichler, K. Hwang, and A. Weisshaar, "Wide-Band Distributed  Modeling of Spiral Inductors in RFICs," IEEE MTT-S International Microwave Symposium Digest, pp. 1011-1014, June 2003.
  • D. Melendy and A. Weisshaar, "A New Scalable Model for Spiral Inductors on Lossy Silicon Substrate," IEEE MTT-S International Microwave Symposium Digest, pp. 1007-1010, June 2003.
  • A. Luoh, U. Arz, H. Grabinski, D. F. Williams, D. K. Walker, and A. Weisshaar, "Broadband Impedance Parameters Of Asymmetric Coupled CMOS Interconnects: New Closed-Form Expressions and Comparison with Measurements," 7th IEEE Workshop on Signal Propagation on Interconnects, Siena, Italy, May 2003; proceedings, pp. 7-10.
  • A. Luoh and A. Weisshaar, "Closed-Form Expressions for the Line Parameters of Co-Planar On-Chip Interconnects on Lossy Silicon Substrates," Proc. IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2002), pp. 341-344, Oct. 2002.
  • D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, "Wide-Band Compact Modeling of Spiral Inductors in RFICs," in IEEE MTT-S International Microwave Symposium Digest, pp. 717-720, June 2002.
  • H. Lan, A. Luoh, and A. Weisshaar, "Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate," Proc. IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), pp. 335-338, Oct. 2001.
  • C.Y. Lim, R. K. Settaluri, V. K. Tripathi, and A. Weisshaar, "Compact Folded-Line RF Power Dividers," Proc. 34th International Symposium on Microelectronics (IMAPS 2001), pp. 725-730, Oct. 2001.
  • J. Zheng, J. P. Li, and A. Weisshaar, "Modeling of 3-D Planar Conducting Structures on Lossy Silicon Substrate in High Frequency Integrated Circuits," IEEE MTT-S International Microwave Symposium Digest, pp. 1265-1268, May 2001.
  • A. Weisshaar and H. Lan, "Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate," IEEE MTT-S International Microwave Symposium Digest, pp. 1753-1756, May 2001.
  • J. Zheng, V. K. Tripathi, and A. Weisshaar, "Characterization and Modeling of Multiple Coupled On-Chip Interconnects on Silicon Substrate," Proc. IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2000), pp. 333-336, Oct. 2000.
  • R. D. Lutz, V. K. Tripathi, and A. Weisshaar, "Enhanced Transmission Characteristics of On-Chip Interconnects with Orthogonal Gridded Shield," Proc. IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2000), pp. 329-332, Oct. 2000.
  • R. D. Lutz, V. K. Tripathi, A. Weisshaar, "Design Considerations for Multilevel Spiral Inductors in RFICs, Proc. 33rd International Symposium on Microelectronics (IMAPS 2000), pp. 414-419, Sept. 2000.
  • J. Zheng, V. K. Tripathi, and A. Weisshaar, "Reduced Order Modeling of Coupled On-Chip Interconnects for Silicon-based RF Integrated Circuits," IEEE MTT-S International Microwave Symposium Digest, pp. 973-976, June 2000.
  • J. Zheng, V. K. Tripathi, and A. Weisshaar, "Development of CAD-Oriented Models for On-Chip Interconnects on Silicon," 4th IEEE Workshop on Signal Propagation on Interconnects, Magdeburg, Germany, May 2000; IEEE Workshop Digest of Abstracts, 2000.





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