Andreas Weisshaar received the Diplom-Ingenieur (Dipl.-Ing.) degree in electrical engineering from the University of Stuttgart, Stuttgart, Germany in 1987, and the M.S. and Ph.D. degrees in electrical and computer engineering from Oregon State University, Corvallis in 1986 and 1991, respectively.
In 1991, he joined the Department of Electrical and Computer Engineering (now School of Electrical Engineering and Computer Science) at Oregon State University, where he is currently a full professor. He also serves as director of the Center for Design of Analog-Digital Integrated Circuits (CDADIC). From 2008 to 2011 he served as program director for communications, circuits, and sensing-systems with the U.S. National Science Foundation.
His current research interests include integrated passive RF/microwave circuits and components, electronic packaging, and wireless communications and power transfer. He has authored/co-authored numerous archival papers, co-authored Transmission Lines and Wave Propagation, 4th Edition (Boca Raton, FL: CRC Press, 2001), and authored the review chapter “Transmission Lines” in Handbook of Engineering Electromagnetics, edited by R. Bansal (Marcel Dekker, NY, 2004). He was elected to the grade of Fellow of the IEEE “for contributions to modeling of on-chip interconnects and integrated passive microwave components.”
Weisshaar’s current professional service includes member of the editorial board of the Proceedings of the IEEE since 2013, associate editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology since 2011, and serving on several technical program committees. His past professional service includes general co-chair of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems in 2008 and 2009, guest editor of the Symposium Issue of the IEEE Transactions of Microwave Theory and Techniques in 2002, and guest editor of the Special Issue on Future Spectrum Access of the Proceedings of the IEEE in 2014, and associate editor of the IEEE Microwave and Wireless Components Letters from 2003 to 2006, and the IEEE Transactions on Advanced Packaging from 2004 to 2010.