OREGON STATE UNIVERSITY

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Biblio

Found 49 results
Filters: Author is Weisshaar, Andreas  [Clear All Filters]
2013
Gaskill, S., A. Papou, A. Mohan, W. French, and A. Weisshaar, "Nonlinear Frequency-Dependent Model for Microinductors With Magnetic Core", IEEE Electron Device Letters, vol. 34, issue 2, pp. 304 - 306, 02/2013.
2012
Shilimkar, V. S., S. G. Gaskill, and A. Weisshaar, "Efficient modeling of metal fill parasitic capacitance in on-chip transmission lines", IEEE/MTT-S International Microwave Symposium - MTT 2012, Montreal, QC, Canada, IEEE, pp. 1 - 3, 06/2012.
2011
Shilimkar, V. S., S. G. Gaskill, and A. Weisshaar, "Closed-form expressions for modeling metal fill effects in interconnects", 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI), Naples, Italy, IEEE, pp. 97 - 100, 05/2011.
2010
Gaskill, S. G., V. S. Shilimkar, and A. Weisshaar, "Wide-range closed-form eddy-current loss formula for metal fill", 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, IEEE, pp. 129 - 132, 10/2010.
2009
Gaskill, S. G., V. S. Shilimkar, and A. Weisshaar, "Accurate closed-form capacitance extraction formulas for metal fill in RFICs", 2009 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), Boston, MA, IEEE, pp. 611 - 614, 06/2009.
Paul, D., M. S. Nakhla, R. Achar, and A. Weisshaar, "Broadband Modeling of High-Frequency Microwave Devices", IEEE Transactions on Microwave Theory and Techniques, vol. 57, issue 2, pp. 361 - 373, 02/2009.
Shilimkar, V. S., S. G. Gaskill, and A. Weisshaar, "Impact of Metal Fill on On-chip Interconnect Performance", Proc. IEEE 18th Topical Meeting on Electrical Performance of Electronic Packaging and Systems (EPEPS'2009), pp. 101-104, 10/2009.
2008
Gaskill, S. G., V. S. Shilimkar, and A. Weisshaar, "Isolation enhancement in integrated circuits using dummy metal fill", 2008 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), Atlanta, GA, IEEE, pp. 483 - 486, 06/2008.
Gaskill, S. G., V. S. Shilimkar, and A. Weisshaar, "Noise Suppression in VLSI Circuits Using Dummy Metal Fill", 2008 IEEE Workshop on Signal Propagation on Interconnects (SPI), Avignon, France, IEEE, pp. 1 - 4, 05/2008.
Walkey, C., D. Paul, M. S. Nakhla, R. Achar, and A. Weisshaar, "A novel passivity verification and enforcement algorithm for macromodels of microwave devices", IEEE MTT-S International Microwave Symposium Digest - MTT 2008, Atlanta, GA, IEEE, pp. 611 - 614, 06/2008.
2007
Orhanovic, I., R. J. Crinon, F. W. R. Chaplen, and A. Weisshaar, "Signal Transduction Pathway Modeling Using Sequences of Chromatophore Images", IEEE Transactions on Nanobioscience, vol. 6, issue 3, pp. 210 - 218, 09/2007.
2006
Paul, D., M. S. Nakhla, R. Achar, and A. Weisshaar, "An Automated Algorithm for Broadband Modeling of High-Frequency Microwave Devices", 2006 IEEE MTT-S International Microwave Symposium Digest, San Francisco, CA, IEEE, pp. 1767 - 1770, 06/2006.
Paul, D., M. S. Nakhla, R. Achar, and A. Weisshaar, "Broadband Macromodelling of High-Speed Passive Modules", 2006 IEEE Workship on Signal Propagation on Interconnects, Berlin, Germany, IEEE, pp. 107 - 108, 05/2006.
Kolstad, J., C. Blevins, J. M. Dunn, and A. Weisshaar, "A New Circuit Augmentation Method for Modeling of Interconnects and Passive Components", IEEE Transactions on Advanced Packaging, vol. 29, issue 1, pp. 67 - 77, 02/2006.
Paul, D., M. S. Nakhla, R. Achar, and A. Weisshaar, "A Passive Algorithm for Modeling Frequency-Dependent Parameters of Coupled Interconnects", 2006 IEEE Electrical Performane of Electronic Packaging, Scottsdale, AZ, IEEE, pp. 185 - 188, 10/2006.
2005
Blevins, C., and A. Weisshaar, "Derivation of a network macromodel model with delay extraction for efficient time-domain simulation of lossy transmission lines", IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, Austin, TX, IEEE, pp. 341 - 344, 10/2005.
Mayevskiy, Y., A. Watson, P. Francis, K. Hwang, and A. Weisshaar, "A new compact model for monolithic transformers in silicon-based RFICs", IEEE Microwave and Wireless Components Letters, vol. 15, issue 6, pp. 419 - 421, 06/2005.
2004
Ferwalt, D. W., and A. Weisshaar, "A base control doherty power amplifier for improved efficiency in GSM handsets", 2004 IEEE MTT-S International Microwave Symposium Digest, vol. 2, Forth Worth, TX, IEEE, pp. 895 - 898, 06/2004.
Weisshaar, A., and A. Luoh, "Closed-Form Expressions for the Series Impedance Parameters of On-Chip Interconnects on Multilayer Silicon Substrates", IEEE Transactions on Advanced Packaging, vol. 27, issue 1, pp. 126 - 134, 02/2004.
Watson, A., Y. Mayevskiy, P. Francis, K. Hwang, G. Srinivasan, and A. Weisshaar, "Compact modeling of differential spiral inductors in si-based RFICs", 2004 IEEE MTT-S International Microwave Symposium Digest, vol. 2, Forth Worth, TX, IEEE, pp. 1051 - 1054, 06/2004.
Watson, A., D. Melendy, P. Francis, K. Hwang, and A. Weisshaar, "A Comprehensive Compact-Modeling Methodology for Spiral Inductors in Silicon-Based RFICs", IEEE Transactions on Microwave Theory and Techniques, vol. 52, issue 3, pp. 849 - 857, 03/2004.
Kolstad, J., C. Blevins, J. M. Dunn, and A. Weisshaar, "A new modeling methodology for passive components based on black-box augmentation combined with equivalent circuit perturbation", Electrical Performance of Electronic Packaging, Portland, OR, IEEE, pp. 259 - 262, 10/2004.
2003
Luoh, A., U. Arz, H. Grabinski, D. F. Williams, D. K. Walker, and A. Weisshaar, "Broadband Impedance Parameters of Asymmetric Coupled CMOS Interconnects: New Closed-Form Expressions and Comparison with Measurements", 7th IEEE Workshop on Signal Propagation on Interconnects, Siena, Italy, pp. Siena, Italy, 05/2003.
Settaluri, R. K., and A. Weisshaar, "A broadside-edge-coupled vialess balun", IEEE MTT-S International Microwave Symposium - IMS 2003, Philadelphia, PA, IEEE, pp. 1251 - 1254, 06/2003.
Lim, C. Y., R. K. Settaluri, V. K. Tripathi, and A. Weisshaar, "Compact single-level and multilevel folded-line RF power dividers", Microwave and Optical Technology Letters, vol. 39, issue 3, pp. 187 - 189, 11/2003.

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