Corvallis semiconductor materials startup Inpria raises $7.3 million from Samsung, Intel
Two of the world’s biggest chipmakers, and the industry’s biggest equipment manufacturer – are investing $7.3 million in a Corvallis startup called Inpria Corp. The 12-person company, which spun out of Oregon State University in 2007, has new chemical technology designed to improve chip lithography and enable EUV. The Oregonian

Chipmakers plough cash into EUV
Three of the big names in chipmaking are putting $7.3 million into a tiny start-up called Inpria which is improving chip lithography and developing a lithography tool known as extreme ultraviolet. Andrew Grenville, Inpria's chief executive told Oregon Live that Samsung Venture Investment Corp. led the round, joined by Intel Capital and Applied Ventures – the venture capital arm of equipment-maker Applied Materials. TechEyeElectronicsWeekly.comGlobal University Venturing

Why Intel, Applied Materials are banking on a Corvallis startup
Inpria is developing metal oxide-based material that will allow semiconductor companies to make smaller chips and features. The material has been designed from the beginning to be a drop-in replacement for current technology, meaning chip makers won’t have to change their process to accommodate the new material. The company, which spun out of Oregon State University research, already has 12 employees, many of whom are from OSU. Portland Business Journal

EECS Alumnus Howard Yang: Visionary Leader
Howard Yang was the first integrated-circuits (IC) designer to return to China from Silicon Valley and help lead the high-tech transformation there starting in the early 1990s through education and entrepreneurship. At a time when mixed-signal design was unknown in China, he taught engineers and graduate students at Fudan University in Shanghai, and co-founded the first IC design company in China. EECS

Software Studs: Beavers Dominate at Prestigious Conference
Oregon State University is well represented at the premiere software engineering conference, ICSE, which will be held in Hyderabad, India this year. Professors Danny Dig, Alex Groce and Carlos Jensen, and Ph.D students, Caius Brindescu, Mihai Codoban, Rahul Gopinath and Sergey Shmarkatiuk, have a combined total of four papers accepted to the prestigious research track. EECS

OSU student Darren Carpenter on campus diversity
Darren Carpenter, an electrical and computer engineering major at Oregon State University in Corvallis, is one of only 366 black students on a campus of 27,925. USA Today (video)

Turmoil engulfs stability at EECS
Students, staff and faculty in the School of Electrical Engineering and Computer Science seem baffled after the sudden removal of department head Terri Fiez and College of Engineering Dean Sandra Woods. The Daily Barometer

Will Ashford’s appointment end the EECS controversy?
This whole situation over at EECS has just been one screwup after another from the beginning, and it has been handled poorly throughout. The administration’s fresh start, in the wake of Woods’ firing, is bringing in Scott Ashford as the new dean, and the acting department head of both EECS and Civil and Construction Engineering.  The Daily Barometer

Provost, dean address engineering changes
Oregon State University Provost Sabah Randhawa and College of Engineering Dean Scott Ashford spoke to engineering faculty and staff Wednesday to address two abrupt changes in college leadership. The meeting, which took place in a packed Construction & Engineering Hall at the LaSells Stewart Center, addressed plans to move forward in the College of Engineering following Randhawa’s decision to have both Sandra Woods and Terri Fiez step down Friday. The Daily Barometer, OBP

Oregon State U. Replaces Dean Amid Turmoil in Engineering College
Oregon State University has replaced the dean of its College of Engineering and removed the head of its program for electrical engineering and computer science following months of turmoil, The Oregonian reported. Bloomberg Businessweek, The Chronicle of Higher Education, Inside Higher Ed,

Re-engineering the OSU College of Engineering: Editorial
About 15 years ago, Oregon State University launched a 10-year, $180 million campaign “to build its College of Engineering into one of the nation's top 25 engineering institutions.” Today, the most pressing goal for the OSU engineering school is to restore unity and stability after divisive changes in leadership. The Oregonian, ASEE

KBVR Beaver News - February 20, 2014
News segment on the shakeup in leadership in the College of Engineering, from the students' perspective. KBVR (video)


Calling all FIRST Robotics Alumni!
Are you interested in getting involved in organizing events? Are you interested in mentoring middle through high school students? Are you interested in remaining, or becoming, a part of the FIRST community? Then this is the opportunity for you! If you are interested in getting involved, come to the inaugural meeting on Monday February 24th at 6:00 PM in KEC 1005. PIZZA WILL BE PROVIDED! Leadership positions are still available and make for a top-notch resume builder! Details

Volunteers Needed for OSU FIRST Robotics Competition District Event
The OSU Robotics Club is hosting a FIRST Robotics Competition District Competition on Friday and Saturday, April 4-5, 2014. We need your help to make this competition a success! There will be over 28 teams competing, and we need robot inspectors, queuers, pit administration, field resetters, A/V techs, and more. All volunteers will receive a t-shirt and breakfast/lunch on the day of the competition. To learn about different volunteer positions and sign up, please visit or email Taj Morton ( with questions. Be sure to select "Oregon State University District" as the event to volunteer at after registering.


How to Build an App in <59 Minutes
Tuesday, February 25, Thetus, 34 NW 1st Ave, Portland OR, 5:30-7:30 PM
A lot has changed with the tools and methods for web-based and mobile development. Affordable cloud hosting and full stack development solutions exist in great numbers. But what is the real benefit? Can using these new tools help build better software, faster? Or is it just for toy apps? Join the TAO Developer Forum as developers build a responsive web-based application using some of the newest technologies available (AngularJS, RESTful services, Firebase, Xcode, JetBrains, AppCode, JetBrains WebStorm, Android Studio, Objective-C, Java, Cloud providers, JIRA, GitHub and so on). The event will start with the audience selecting the application that will be built, and will lend with a Q&A session. If you're looking to learn about the latest technology trends in web and mobile development, this is the event to be at. Details


Monday, February 24, 4:00 PM - 4:50 PM, KEC 1001."Spreadsheet Engineering" presented by Jácome Cunha, Postdoctoral Fellow, University of Minho / Oregon State University. Details

Tuesday, Feb 25, 3:30 p.m. talk, refreshments following talk, 220 Deschutes Hall (Colloquium Room), University of Oregon. "Language-enabled Integration of Distributed Complex Event Processing Systems and Sensor Networks" presented by Joe Sventek, University of Glasglow, Scotland. NOTE: This is NOT part of the EECS colloquium series. Details

Friday, February 28, 8:45am - 10:00am, KEC 1007. "Data Exploration and Analytics in Social Media and the Deep Web" presented by Gautam Das, Professor, Computer Science and Engineering Department, University of Texas at Arlington. Details

Monday, March 3, 8:45am - 9:45am, KEC 1007. "Provisioning of Next Generation Wireless Networks: A Large-Scale Optimization Approach" presented by Mingyi Hong, Research Assistant Professor, Department of Electrical and Computer Engineering, University of Minnesota. Details

Wednesday, March 5, 8:45 AM - 9:45 AM, KEC 1007. "Fundamentals of Heterogeneous Cellular Networks" presented by Harpreet S. Dhillon, Postdoctoral Research Associate, Department of Electrical Engineering, University of Southern California. Details

Monday, March 10, 8:45 AM - 10:00 AM, KEC 1007. "To Merge or Not to Merge: Managing Software Families" presented by Julia Rubin, PhD Candidate, Department of Computer Science, University of Toronto. Details


Full scholarships for English-taught computer science graduate programs at Politecnico di Milano
We are pleased to offer merit-based scholarships for excellent candidates who come from outside of Italy. All three scholarship types include a full tuition waiver. We’ll be hosting a webinar at 1pm EST on February 26 with our admissions team to go over scholarship details and tips for applying. Both students and administrators are welcome to join. The webinar will be recorded, and a link to recording will be sent to everyone who registers, so please feel free to register even if the timing doesn’t work for you. Details


Social Computing @ HCII
The Social Computing Lab at Carnegie Mellon has an exciting summer research opportunity available to undergraduate students. This research program encourages applications from students who would like to conduct research in the fields of psychology, computer science, human-computer interfaces and language technologies. Application deadline: March 10. Details


Recent job postings on Beaver JobNet
Students must apply through Beaver JobNet to access/apply for the postings. Using their onid accounts, students/alums can log in here: Any issues with Beaver JobNet, contact

OSU graphic design student is looking for a fellow student to help create a responsive website for a doctor's office for desktop, tablet and smartphone. Simple design with a few bells and whistles including rotating image wheel, submit forms online, and register as a new patient online. Details

NASA's Goddard Space Flight Center anticipates hosting at least 400 student interns this summer. NASA is still actively recruiting interns for its paid summer internship program! Internships are available in a wide variety of disciplines including engineering, physics, astronomy, life and earth sciences, and even some business and finance. The deadline is March 1st. To apply, visit to complete your base application and apply for up to 15 specific internship opportunities. Details

Mechanical and Electrical Engineering Internships that we have available for summer 2014 through the McMinnville Works internship program. There will be 5-8 positions, which are all located in McMinnville, Oregon at companies like: Cascade Steel Rolling Mills, Solid Form Fabrication, Meggitt Polymers and Composites. The application for these internships are NOW OPEN. Details

Analog/Mixed-Signal IC Layout Designer, Fidelis Companies client. The position duties included IC layout/physical design and running mixed-mode simulations and will have an opportunity to grow into either circuit design or advanced layout design. The company also encourages and will assist with helping this person pursue their Master’s degree once hired. Details

Partial list of jobs posted in the past week through LinkedIn (these are just a few of the hundreds of jobs listed)

Don’t forget to check out the AfterCollege job site, tailored especially for our EECS students. Sample jobs:

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