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Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield

TitleEnhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield
Publication TypeJournal Article
Year of Publication2001
AuthorsLutz, R. D., V. K. Tripathi, and A. Weisshaar
JournalIEEE Transactions on Advanced Packaging
Volume24
Issue3
Pagination288 - 293
Date Published08/2001
ISSN15213323
Abstract

On-chip interconnects over an orthogonal grid of grounded shielding lines on the silicon substrate are characterized by full-wave electromagnetic simulation. The analysis is based on a unit cell of the periodic shielded interconnect structure. It is demonstrated that the shielding structure may help to significantly enhance the transmission characteristics of on-chip interconnects particularly in analog and mixed-signal integrated circuits with bulk substrate resistivity on the order of 10 Ω-cm. Simulation results for the extracted R, L, G, C transmission line parameters show a significant decrease in the frequency-dependence of the distributed shunt capacitance as well as decrease in shunt conductance with the shielding structure present, while the series inductance and series resistance parameters are nearly unaffected. An extension of the equivalent circuit model for the shunt admittance of unshielded on-chip interconnects to include the effects of shielding is also presented.

DOI10.1109/6040.938295
Short TitleIEEE Trans. Adv. Packag.