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Manufacturing of board level waveguide bus using hard mold

TitleManufacturing of board level waveguide bus using hard mold
Publication TypeConference Paper
Year of Publication2012
AuthorsLin, X., X. Dou, A. Hosseini, A. X. Wang, and R. T. Chen
Conference Name2012 IEEE Optical Interconnects Conference
Pagination139 - 140
Date Published05/2012
PublisherIEEE
Conference LocationSanta Fe, NM
ISBN Number978-1-4577-1618-8
Abstract

Optical interconnects of straight waveguides and bi-directional bus architecture have been successfully fabricated on flexible substrate using nickel hard mold. Optical out-of-plane loss test and high speed data transmission at 10Gbps have been demonstrated.

DOI10.1109/OIC.2012.6224484